Edited by Eamonn Ryan
Growing demand for artificial intelligence (AI) and high-performance computing (HPC) is driving the need for cooling systems capable of managing extremely high heat loads in a compact footprint.
The versatile, prefabricated Vertiv MegaMod HDX power and thermal infrastructure integrates direct-to-chip liquid cooling with air cooling, to support AI and high-density requirements. © Vertiv
New configurations of the MegaMod HDX hybrid cooling and power solution are designed to support these requirements, delivering scalable capacity of up to 10MW and supporting rack densities from 50kW to more than 100kW per rack.
The prefabricated solution combines direct-to-chip liquid cooling with air-based cooling systems, allowing HVAC and data centre engineers to manage the thermal demands of modern GPU-based workloads more efficiently. The hybrid approach enables targeted liquid cooling at the heat source while maintaining airflow for residual heat removal and redundancy.
Two configuration options are available to suit different site requirements.
The compact configuration features a standard module height, supports up to 13 racks, and delivers up to 1.25MW of power capacity.
The combo configuration uses an extended-height design, supporting up to 144 racks with total capacity of up to 10MW.
Both options are designed for pod-based data centre layouts, allowing operators to deploy cooling and power infrastructure quickly and expand capacity as computing demand grows.
From an HVAC perspective, the solution incorporates a hybrid thermal architecture that supports stable operation under fluctuating loads. Integrated buffer tanks provide thermal inertia, helping maintain temperature control during maintenance events or rapid load changes. Redundant power and cooling paths are built into the modular design to support continuous operation.
The prefabricated, factory-tested approach reduces on-site installation complexity and supports consistent performance across deployments. This can be particularly beneficial in projects where speed of deployment, space constraints, or predictable cooling performance are critical.
The system integrates with a broader ecosystem of power distribution, cooling distribution units, rear-door heat exchangers and monitoring platforms, enabling co-ordinated management of power and thermal performance across high-density environments.
Source: Vertiv
